HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 91
HD64F2676VFC33
Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Specifications of HD64F2676VFC33
Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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Table 2.3
Note:
Instruction
MOV
MOVFPE
MOVTPE
POP
PUSH
LDM
STM
* Size refers to the operand size.
B: Byte
W: Word
L: Longword
Data Transfer Instructions
L
Size *
B/W/L
B
B
W/L
W/L
L
Function
(EAs)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn.
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP.
@SP+
Pops two or more general registers from the stack.
Pushes two or more general registers onto the stack.
Cannot be used in this LSI.
Cannot be used in this LSI.
@SP+
Rn
Rn (register list)
@–SP
Rd, Rs
Rn
Rn (register list)
@–SP
(EAd)
Rev. 3.00 Mar 17, 2006 page 39 of 926
REJ09B0283-0300
Section 2 CPU
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