HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 302

• Manufacturer Part Number: HD64F2676VFC33
• Description: IC H8S MCU FLASH 256K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2676VFC33

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 6 Bus Controller (BSC)
6.11
This LSI can release the external bus in response to a bus request from an external device. In the
external bus released state, internal bus masters except the EXDMAC continue to operate as long
as there is no external access. If any of the following requests are issued in the external bus
released state, the BREQO signal can be driven low to output a bus request externally.
Rev. 3.00 Mar 17, 2006 page 250 of 926
REJ09B0283-0300
When an internal bus master wants to perform an external access
When a refresh request is generated
When a SLEEP instruction is executed to place the chip in software standby mode or all-
module-clocks-stopped mode
External space
write
Figure 6.83 Example of Timing when Write Data Buffer Function is Used
Bus Release
Internal address bus
Internal read signal
HWR, LWR
D15 to D0
A23 to A0
CSn
T
1
On-chip memory read Internal I/O register read
T
Internal memory
2
External write cycle
External address
T
W
Internal I/O register address
T
W
T
3