HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 765

IC H8S MCU FLASH 256K 144-QFP

HD64F2676VFC33

Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2676VFC33

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Write transmit data to TDR and
clear TDRE flag in SSR to 0
Read TDRE flag in SSR
Read TEND flag in SSR
Clear TE bit in SCR to 0
Start of transmission
All data transmitted?
Initialization
TDRE = 1?
TEND = 1?
<End>
Figure 15.17 Sample Serial Transmission Flowchart
Yes
Yes
Yes
No
No
No
Section 15 Serial Communication Interface (SCI, IrDA)
[3]
[2]
[1]
[1] SCI initialization:
[2] SCI status check and transmit data
[3] Serial transmission continuation
The TxD pin is automatically
designated as the transmit data output
pin.
write:
Read SSR and check that the TDRE
flag is set to 1, then write transmit data
to TDR and clear the TDRE flag to 0.
procedure:
To continue serial transmission, be
sure to read 1 from the TDRE flag to
confirm that writing is possible, then
write data to TDR, and then clear the
TDRE flag to 0.
Checking and clearing of the TDRE
flag is automatic when the DMAC or
DTC is activated by a transmit-data-
empty interrupt (TXI) request and data
is written to TDR.
Rev. 3.00 Mar 17, 2006 page 713 of 926
REJ09B0283-0300

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