HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 31
HD64F2676VFC33
Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Specifications of HD64F2676VFC33
Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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750 000
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20 000
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22.2 Operation .......................................................................................................................... 825
22.3
22.4 Usage Notes ...................................................................................................................... 832
Section 23 List of Registers
23.1 Register Addresses
23.2 Register Bits...................................................................................................................... 844
23.3 Register States in Each Operating Mode........................................................................... 856
Section 24 Electrical Characteristics
24.1 Absolute Maximum Ratings ............................................................................................. 865
24.2 DC Characteristics ............................................................................................................ 866
24.3 AC Characteristics ............................................................................................................ 870
24.4 A/D Conversion Characteristics........................................................................................ 906
24.5 D/A Conversion Characteristics........................................................................................ 906
24.6 Flash Memory Characteristics........................................................................................... 907
24.7 Usage Note........................................................................................................................ 908
Appendix
A.
B.
C.
Index
22.1.2 Module Stop Control Registers H and L (MSTPCRH, MSTPCRL).................... 824
22.2.1 Clock Division Mode........................................................................................... 825
22.2.2 Sleep Mode .......................................................................................................... 826
22.2.3 Software Standby Mode....................................................................................... 826
22.2.4 Hardware Standby Mode ..................................................................................... 829
22.2.5 Module Stop Mode .............................................................................................. 830
22.2.6 All-Module-Clocks-Stop Mode ........................................................................... 831
22.4.1 I/O Port Status...................................................................................................... 832
22.4.2 Current Dissipation during Oscillation Stabilization Standby Period.................. 832
22.4.3 EXDMAC/DMAC/DTC Module Stop ................................................................ 832
22.4.4 On-Chip Peripheral Module Interrupts ................................................................ 832
22.4.5 Writing to MSTPCR ............................................................................................ 832
(by functional module, in order of the corresponding section numbers)........................... 833
I/O Port States in Each Pin State....................................................................................... 909
Product Lineup.................................................................................................................. 918
Package Dimensions ......................................................................................................... 919
.......................................................................................................................................... 921
Clock Output Control..................................................................................................... 831
.................................................................................................................................. 909
.............................................................................................. 833
.............................................................................. 865
Rev. 3.00 Mar 17, 2006 page xxix of l
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