HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 223

IC H8S MCU FLASH 256K 144-QFP

HD64F2676VFC33

Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2676VFC33

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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6.5.6
Some external I/O devices require a setup time and hold time between address and CS signals and
strobe signals such as RD, HWR, and LWR. Settings can be made in the CSACR register to insert
states in which only the CS, AS, and address signals are asserted before and after a basic bus space
access cycle. Extension of the CS assertion period can be set for individual areas. With the CS
assertion extension period in write access, the data setup and hold times are less stringent since the
write data is output to the data bus.
RDNn = 0
RDNn = 1
Extension of Chip Select (CS
Address bus
CSn
AS
RD
Data bus
RD
Data bus
DACK,
EDACK
Figure 6.19 Example of Read Strobe Timing
CS) Assertion Period
CS
CS
T
1
Rev. 3.00 Mar 17, 2006 page 171 of 926
Bus cycle
T
2
Section 6 Bus Controller (BSC)
REJ09B0283-0300
T
3

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