HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 265
HD64F2676VFC33
Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Specifications of HD64F2676VFC33
Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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(Address shift size set to 8 bits)
DCTL
Figure 6.51 Example of DQMU and DQML Byte Control
This LSI
Notes: 1. Bank control is not available.
CS5 (SDRAMø)
UCAS (DQMU)
LCAS (DQML)
2. The CKE and CS pins must be fixed to 1 when the power supply is input.
3. The CS pin must be fixed to 0 before accessing synchronous DRAM.
D15 to D0
I/O PORT
CS2 (RAS)
CS3 (CAS)
CS4 (WE)
OE (CKE)
A23
A21
A12
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
Rev. 3.00 Mar 17, 2006 page 213 of 926
16-Mbit synchronous DRAM
1-Mword × 16 bits × 4-bank configuration
8-bit column address
DQMU
RAS
CAS
WE
A13 (BS1)
A12 (BS0)
A11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
DQ15 to DQ0
CKE
CS
CLK
DQML
Section 6 Bus Controller (BSC)
address: A13/A12
Column address
input: A11 to A0
input: A7 to A0
Row address
Bank select
REJ09B0283-0300
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