HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 182

• Manufacturer Part Number: HD64F2676VFC33
• Description: IC H8S MCU FLASH 256K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2676VFC33

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 6 Bus Controller (BSC)
Bit
10
9
8
Note:
Legend: x: Don’t care.
Rev. 3.00 Mar 17, 2006 page 130 of 926
REJ09B0283-0300
* The synchronous DRAM interface is not supported in the H8S/2678 Group.
Bit Name
W22
W21
W20
Initial Value
1
1
1
R/W
R/W
R/W
R/W
Description
Area 2 Wait Control 2 to 0
These bits select the number of program wait
states when accessing area 2 while AST2 bit in
ASTCR = 1.
A CAS latency is set when the synchronous
DRAM is connected * . The setting of area 2 is
reflected to the setting of areas 2 to 5. A CAS
latency can be set regardless of whether or not
an ASTCR wait state insertion is enabled.
000:
001:
010:
011:
100:
101:
110:
111:
000:
001:
010:
011:
1XXX: Setting prohibited.
Program wait not inserted
1 program wait state inserted
2 program wait states inserted
3 program wait states inserted
4 program wait states inserted
5 program wait states inserted
6 program wait states inserted
7 program wait states inserted
Synchronous DRAM of CAS latency 1 is
connected to areas 2 to 5.
Synchronous DRAM of CAS latency 2 is
connected to areas 2 to 5.
Synchronous DRAM of CAS latency 3 is
connected to areas 2 to 5.
Synchronous DRAM of CAS latency 4 is
connected to areas 2 to 5.