S9S12HY64J0MLL Freescale Semiconductor, S9S12HY64J0MLL Datasheet - Page 723

• Manufacturer Part Number: S9S12HY64J0MLL
• Description: MCU 64K FLASH AUTO 100-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of S9S12HY64J0MLL

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LCD, Motor control PWM, POR, PWM, WDT
• Number Of I /o: 80
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 100-LQFP
• Controller Family/series: S12
• No. Of I/o's: 80
• Ram Memory Size: 4KB
• Cpu Speed: 64MHz
• No. Of Timers: 2
• Rohs Compliant: Yes
• Processor Series: S12HY
• Core: HCS12
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: DEMO9S12HY64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

1. The values for thermal resistance are achieved by package simulations
2. Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with
3. Thermal characterization parameter
A.1.9
This section describes the characteristics of all I/O pins except EXTAL, XTAL, TEST and supply pins
Freescale Semiconductor
Conditions are 4.5 V < V
I/O Characteristics for all I/O pins except EXTAL, XTAL,TEST and supply pins.
Num
Num C
10
the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described by MIL-
STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package is
being used with a heat sink.
case as defined in JESD51-2.
enviroment.
1
2
3
4
5
6
7
8
9
1
2
3
4
C Input hysteresis
P Input high voltage
T Input high voltage
P Input low voltage
T Input low voltage
P Input leakage current (pins in high impedance input
C
D
D
D
D
D
D
D
D
D
D
mode)
Thermal resistance LQFP 100, single sided PCB
Thermal resistance LQFP 100, double sided PCB
with 2 internal planes
Junction to Board LQFP 100
Junction to Case LQFP 100
Junction to Package Top LQFP 100
Thermal resistance LQFP 64, single sided PCB
Thermal resistance LQFP 64, double sided PCB
with 2 internal planes
Junction to Board LQFP 64
Junction to Case LQFP 64
Junction to Package Top LQFP 64
I/O Characteristics
V in = V DD35 or V SS35
(1)
, all io pins except PU/PV
DD35
< 5.5 V junction temperature from –40 C to +150 C, unless otherwise noted
Rating
3
3
JT
Table A-5. Thermal Package Characteristics
MC9S12HY/HA-Family Reference Manual, Rev. 1.04
Rating
is a useful value to use to estimate junction temperature in a steady state customer
2
JT
(2)
is the “resistance” from junction to reference point thermocouple on top center of the
Table A-6. 5-V I/O Characteristics
3
(3)
LQFP100
LQFP 64
2
2
Symbol
V HYS
V
V
V
V
I
in
IH
IH
IL
IL
Symbol
JC
JC
JA
JA
JB
JA
JA
JB
JT
JT
0.65*V
V
SS35
Min
–1
—
—
– 0.3
DD35
Min
—
—
—
—
—
—
—
—
—
—
(1)
Typ
250
—
—
—
—
—
Typ
—
—
—
—
—
—
—
—
—
—
Electrical Characteristics
V
0.35*V
DD35
Max
Max
—
—
—
1
61
48
34
14
70
52
35
17
2
3
+ 0.3
DD35
Unit
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
mV
V
V
V
V
A
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