LPC2468FBD208,551 NXP Semiconductors, LPC2468FBD208,551 Datasheet - Page 332

• Manufacturer Part Number: LPC2468FBD208,551
• Description: IC ARM7 MCU FLASH 512K 208-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2468FBD208,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 208-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 98K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2S/ISP/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 6
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, IRD-LPC2468-DEV, SAB-TFBGA208, KSK-LPC2468-PL
• Development Tools By Supplier: OM10100
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1025 - KIT DEV IND REF DESIGN LPC2468622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4358 - DISPLAY QVGA TFT FOR OM10100568-4309 - BOARD EXTENSION LPCSTICK568-4308 - EVAL LPC-STICK WITH LPC2468MCB2400U - BOARD EVAL MCB2400 + ULINK2MCB2400 - BOARD EVAL FOR NXP LPC246X SER622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4261; 935282457551; LPC2468FBD208-S

NXP Semiconductors
UM10237_4
User manual
Fig 45. USB device controller block diagram
DMA interface
(AHB master)
(AHB slave)
interface
register
5.1 Analog transceiver
5.2 Serial Interface Engine (SIE)
5.3 Endpoint RAM (EP_RAM)
5.4 EP_RAM access control
The USB Device Controller has a built-in analog transceiver (ATX). The USB ATX
sends/receives the bi-directional D+ and D- signals of the USB bus.
The SIE implements the full USB protocol layer. It is completely hardwired for speed and
needs no firmware intervention. It handles transfer of data between the endpoint buffers in
EP_RAM and the USB bus. The functions of this block include: synchronization pattern
recognition, parallel/serial conversion, bit stuffing/de-stuffing, CRC checking/generation,
PID verification/generation, address recognition, and handshake evaluation/generation.
Each endpoint buffer is implemented as an SRAM based FIFO. The SRAM dedicated for
this purpose is called the EP_RAM. Each realized endpoint has a reserved space in the
EP_RAM. The total EP_RAM space required depends on the number of realized
endpoints, the maximum packet size of the endpoint, and whether the endpoint supports
double buffering.
The EP_RAM Access Control logic handles transfer of data from/to the EP_RAM and the
three sources that can access it: the CPU (via the Register Interface), the SIE, and the
DMA Engine.
USB DEVICE
BLOCK
INTERFACE
MASTER
INTERFACE
REGISTER
BUS
Rev. 04 — 26 August 2009
CONTROL
EP_RAM
ACCESS
EP_RAM
ENGINE
DMA
(4K)
Chapter 13: LPC24XX USB device controller
INTERFACE
ENGINE
SERIAL
UM10237
© NXP B.V. 2009. All rights reserved.
USB_CONNECT1,
USB_CONNECT2
USB_UP_LED1,
USB_UP_LED2
USB_D+1,
USB_D+2
USB_D-1,
USB_D-2
V
BUS
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