LPC2468FBD208,551 NXP Semiconductors, LPC2468FBD208,551 Datasheet - Page 538

IC ARM7 MCU FLASH 512K 208-LQFP

LPC2468FBD208,551

Manufacturer Part Number
LPC2468FBD208,551
Description
IC ARM7 MCU FLASH 512K 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets

Specifications of LPC2468FBD208,551

Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
160
Ram Size
98K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2S/ISP/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
6
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, IRD-LPC2468-DEV, SAB-TFBGA208, KSK-LPC2468-PL
Development Tools By Supplier
OM10100
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1025 - KIT DEV IND REF DESIGN LPC2468622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4358 - DISPLAY QVGA TFT FOR OM10100568-4309 - BOARD EXTENSION LPCSTICK568-4308 - EVAL LPC-STICK WITH LPC2468MCB2400U - BOARD EVAL MCB2400 + ULINK2MCB2400 - BOARD EVAL FOR NXP LPC246X SER622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4261
935282457551
LPC2468FBD208-S

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Quantity
Price
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LPC2468FBD208,551
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LPC2468FBD208,551
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NXP Semiconductors
UM10237_4
User manual
Fig 96. Texas Instruments Synchronous Serial Frame Format: a) Single and b) Continuous/back-to-back Two
a. Single frame transfer
b. Continuous/back-to-back frames transfer
Frames Transfer
DX/DR
CLK
FS
5.2.1 Clock Polarity (CPOL) and Phase (CPHA) control
5.2 SPI frame format
For device configured as a master in this mode, CLK and FS are forced LOW, and the
transmit data line DX is tristated whenever the SSP is idle. Once the bottom entry of the
transmit FIFO contains data, FS is pulsed HIGH for one CLK period. The value to be
transmitted is also transferred from the transmit FIFO to the serial shift register of the
transmit logic. On the next rising edge of CLK, the MSB of the 4 to 16 bit data frame is
shifted out on the DX pin. Likewise, the MSB of the received data is shifted onto the DR
pin by the off-chip serial slave device.
Both the SSP and the off-chip serial slave device then clock each data bit into their serial
shifter on the falling edge of each CLK. The received data is transferred from the serial
shifter to the receive FIFO on the first rising edge of CLK after the LSB has been latched.
The SPI interface is a four-wire interface where the SSEL signal behaves as a slave
select. The main feature of the SPI format is that the inactive state and phase of the SCK
signal are programmable through the CPOL and CPHA bits within the SSPCR0 control
register.
When the CPOL clock polarity control bit is LOW, it produces a steady state low value on
the SCK pin. If the CPOL clock polarity control bit is HIGH, a steady state high value is
placed on the CLK pin when data is not being transferred.
DX/DR
CLK
FS
MSB
4 to 16 bits
Rev. 04 — 26 August 2009
MSB
LSB
4 to 16 bits
MSB
Chapter 20: LPC24XX SSP interface SSP0/1
LSB
4 to 16 bits
LSB
UM10237
© NXP B.V. 2009. All rights reserved.
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