MCF5270CAB100 Freescale Semiconductor, MCF5270CAB100 Datasheet - Page 38

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MCF5270CAB100

Manufacturer Part Number
MCF5270CAB100
Description
MCU V2 COLDFIRE 64K SRAM 160-QFP
Manufacturer
Freescale Semiconductor
Series
MCF527xr
Datasheets

Specifications of MCF5270CAB100

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
100MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals
DMA, WDT
Number Of I /o
39
Program Memory Type
ROMless
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 1.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
160-QFP
Processor Series
MCF527x
Core
ColdFire V2
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Development Tools By Supplier
NNDK-MOD5272-KIT, NNDK-MOD5270-KIT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF5270CAB100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Overview
1.2
The superset device in the MCF5271 family comes in a 196 mold array process ball grid array
(MAPBGA) package.
1-2
Block Diagram
Table 1-1. MCF5271 Family Configurations (Continued)
Figure 1-1
Watchdog Timer (WDT)
Four Periodic Interrupt Timers (PIT)
32-bit DMA Timers
QSPI
UART(s)
I
General Purpose I/O Module (GPIO)
JTAG - IEEE 1149.1 Test Access Port
Package
2
C
shows a top-level block diagram of the MCF5271.
MCF5271 Reference Manual, Rev. 2
Module
MAPBGA
160 QFP
5270
196
x
x
4
x
3
x
x
x
MAPBGA
160 QFP
5271
196
x
x
4
x
3
x
x
x
Freescale Semiconductor

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