UPD78F0890GK(A)-GAJ-AX NEC, UPD78F0890GK(A)-GAJ-AX Datasheet - Page 695

• Manufacturer Part Number: UPD78F0890GK(A)-GAJ-AX
• Description: 8BIT MCU, 128K FLASH, 7K RAM, LQFP
• Manufacturer: NEC

Specifications of UPD78F0890GK(A)-GAJ-AX

• Controller Family/series: UPD78F
• No. Of I/o's: 55
• Ram Memory Size: 7KB
• Cpu Speed: 20MHz
• No. Of Timers: 10
• No. Of Pwm: RoHS Compliant
• Core Size: 8bit
• Program Memory Size: 128KB
• Oscillator Type: External, Internal

sales representative.
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Infrared reflow
Partial heating
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
• 64-pin plastic LQFP (10 × 10)
• 64-pin plastic LQFP (12 × 12)
μ
78F0889GB(A)-GAH-AX, 78F0889GB(A2)-GAH-AX, 78F0890GB(A)-GAH-AX, 78F0890GB(A2)-GAH-AX
μ
78F0889GK(A)-GAJ-AX, 78F0889GK(A2)-GAJ-AX, 78F0890GK(A)-GAJ-AX, 78F0890GK(A2)-GAJ-AX
PD78F0887GB(A)-GAH-AX, 78F0887GB(A2)-GAH-AX, 78F0888GB(A)-GAH-AX, 78F0888GB(A2)-GAH-AX,
PD78F0887GK(A)-GAJ-AX, 78F0887GK(A2)-GAJ-AX, 78F0888GK(A)-GAJ-AX, 78F0888GK(A2)-GAJ-AX,
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 7 days
20 to 72 hours)
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS
Table 30-1. Surface Mounting Type Soldering Conditions
User’s Manual U17554EJ4V0UD
Soldering Conditions
Note
(after that, prebake at 125°C for
IR60-207-3
Condition Symbol
Recommended
−
695