EP3C25F324I7 Altera, EP3C25F324I7 Datasheet - Page 26

IC CYCLONE III FPGA 25K 324 FBGA

EP3C25F324I7

Manufacturer Part Number
EP3C25F324I7
Description
IC CYCLONE III FPGA 25K 324 FBGA
Manufacturer
Altera
Series
Cyclone® IIIr

Specifications of EP3C25F324I7

Number Of Logic Elements/cells
24624
Number Of Labs/clbs
1539
Total Ram Bits
608256
Number Of I /o
215
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
324-FBGA
Family Name
Cyclone III
Number Of Logic Blocks/elements
24624
# I/os (max)
215
Frequency (max)
437.5MHz
Process Technology
65nm
Operating Supply Voltage (typ)
1.2V
Logic Cells
24624
Ram Bits
608256
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
-40C to 100C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
324
Package Type
FBGA
For Use With
544-2370 - KIT STARTER CYCLONE III EP3C25
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EP3C25F324I7
Manufacturer:
Altera
Quantity:
10 000
Part Number:
EP3C25F324I7
Manufacturer:
ALTERA
0
Part Number:
EP3C25F324I7
0
Part Number:
EP3C25F324I7N
Manufacturer:
ALTERA32
Quantity:
181
Part Number:
EP3C25F324I7N
Manufacturer:
Altera
Quantity:
10 000
Part Number:
EP3C25F324I7N
Manufacturer:
XILINX
0
Part Number:
EP3C25F324I7N
Manufacturer:
ALTERA
0
Part Number:
EP3C25F324I7N
0
1–12
Reference and Ordering Information
Figure 1–1. Cyclone III Device Packaging Ordering Information
Figure 1–2. Cyclone III LS Device Packaging Ordering Information
Cyclone III Device Handbook, Volume 1
EP3C: Cyclone III
5
10
16
25
25E
40
55
80
120
E: Plastic Enhanced Quad Flat Pack (EQFP)
Q: Plastic Quad Flat Pack (PQFP)
F: FineLine Ball-Grid Array (FBGA)
U: Ultra FineLine Ball-Grid Array (UBGA)
M: Micro FineLine Ball-Grid Array (MBGA)
EP3CLS: Cyclone III LS
70
100
150
200
F: FineLine Ball-Grid Array (FBGA)
U: Ultra FineLine Ball-Grid Array (UBGA)
Package Type
Device Type
Family Signature
Package Type
Device Type
Family Signature
Figure 1–1
devices.
EP3C
EP3CLS
and
25
70
Figure 1–2
F
F
Number of pins for a particular package:
144
164
240
256
324
484
780
Number of pins for a particular package:
484
780
Pin Count
324
Pin Count
484
show the ordering codes for Cyclone III and Cyclone III LS
C
C
7
7
N
N
Indicates specific device options or
shipment method.
ES: Engineering sample
N: Lead-free devices
6 (fastest)
7
8
C: Commercial temperature (T
I: Industrial temperature (T
A: Automotive temperature (T
Indicates specific device options or
shipment method.
ES: Engineering sample
N: Lead-free devices
7 (fastest)
8
C: Commercial temperature (T
I: Industrial temperature (T
Operating Temperature
Speed Grade
Optional Suffix
Chapter 1: Cyclone III Device Family Overview
Operating Temperature
Speed Grade
Optional Suffix
© December 2009 Altera Corporation
Reference and Ordering Information
J
J
= -40
J
= -40
J
= -40
J
= 0
= 0
°
C to 100
°
°
C to 100
C to 85
°
°
C to 125
C to 85
°
°
C)
°
C)
°
C)
°
C)
C)

Related parts for EP3C25F324I7