MPC564MZP56 Freescale Semiconductor, MPC564MZP56 Datasheet - Page 1151

• Manufacturer Part Number: MPC564MZP56
• Description: IC MCU 512K FLASH 56MHZ 388-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC564MZP56

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 56MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 388-BGA
• Core: PowerPC
• Processor Series: MPC5xx
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 56 MHz
• Data Ram Size: 32 KB
• On-chip Adc: Yes
• Number Of Programmable I/os: 56
• Number Of Timers: 2
• Operating Supply Voltage: 0 V to 5 V
• Mounting Style: SMD/SMT
• A/d Bit Size: 10 bit
• A/d Channels Available: 32
• Height: 1.95 mm
• Interface Type: CAN, JTAG, QSPI, SCI, SPI, UART
• Length: 27 mm
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Voltage (max): 2.7 V, 5.25 V
• Supply Voltage (min): 2.5 V, 4.75 V
• Width: 27 mm
• For Use With: MPC564EVB - KIT EVAL FOR MPC561/562/563/564
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No RoHS Version Available

MF is the multiplication factor in the PLPRCR register (refer to
Reset-Control Register
C.3
C.3.1
Traces connecting capacitors, crystal, resistor should be as short as possible. Therefore, the components
(crystal, resistor and capacitors) should be placed as close to the oscillator pins of the MPC561/MPC563
as possible.
The voltage to the VDDSYN pin should be well regulated and the pin should be provided with an
extremely low impedance path from the VDDSYN filter to the VDDSYN pad.
The VSSSYN pin should be provided with an extremely low impedance path in the board. All the filters
for the supplies should be located as close as possible to the chip package. It is recommended to design
individual VSSSYN plane to improve VSSSYN quietness.
C.3.2
The traces from the oscillator pins and PLL pins of the MPC561/MPC563 should be guarded from all other
traces to reduce crosstalk. It can be provided by keeping other traces away from the oscillator circuit and
placing a ground plane around the components and traces.
C.3.3
IRAMSTBY is the data retention power supply for all on-board RAM arrays (CALRAM, DPTRAM,
DECRAM). It has a shunt regulator circuit to divert excess current to ground in order to regulate voltage
on the IRAMSTBY power supply pin. IRAMSTBY should be connected to a positive power supply, via a
resistor, and bypassed by a capacitor to ground as shown in
Freescale Semiconductor
PLL and Clock Oscillator External Components Layout
Requirements
Traces and Placement
Grounding/Guarding
IRAMSTBY Regulator Circuit
(PLPRCR)” for more information).
Figure C-8. PLL Off-Chip Capacitor Example
MPC561/MPC563 Reference Manual, Rev. 1.2
CXFC
Board
MPC56x Device
VDDSYN
XFC
Figure
Section 8.11.2, “PLL, Low-Power, and
C-9.
Clock and Board Guidelines
C-7