MPC564MZP56 Freescale Semiconductor, MPC564MZP56 Datasheet - Page 1229

• Manufacturer Part Number: MPC564MZP56
• Description: IC MCU 512K FLASH 56MHZ 388-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC564MZP56

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 56MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 388-BGA
• Core: PowerPC
• Processor Series: MPC5xx
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 56 MHz
• Data Ram Size: 32 KB
• On-chip Adc: Yes
• Number Of Programmable I/os: 56
• Number Of Timers: 2
• Operating Supply Voltage: 0 V to 5 V
• Mounting Style: SMD/SMT
• A/d Bit Size: 10 bit
• A/d Channels Available: 32
• Height: 1.95 mm
• Interface Type: CAN, JTAG, QSPI, SCI, SPI, UART
• Length: 27 mm
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Voltage (max): 2.7 V, 5.25 V
• Supply Voltage (min): 2.5 V, 4.75 V
• Width: 27 mm
• For Use With: MPC564EVB - KIT EVAL FOR MPC561/562/563/564
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No RoHS Version Available

F.8
The supply symbols used in this section are described in
There are two power-up/down options. Choosing which one is required for an application will depend
upon circuitry connected to 2.6-V compliant pins and dual 2.6-V/5-V compliant pins. Power-up/down
option A is required if 2.6-V compliant pins and dual 2.6-V/5-V compliant pins are connected to the 5-V
supply with a pull-up resistor or driven by 5-V logic during power-up/down. In applications for which this
scenario is not true the power-up/down option B may be implemented. Option B is less stringent and easier
to ensure over a variety of applications.
Refer to
The power consumption during power-up/down sequencing will stay below the operating power
consumption specifications when following these guidelines.
F.8.1
The Option A power-up sequence (excluding V
The first step in the sequence is required is due to gate-to-drain stress limits for transistors in the pads of
2.6-V compliant pins and dual 2.6-V/5-V compliant pins. Damage can occur if gate-to-drain voltage
potential is greater than 3.1 V. This is only a concern at power-up/down. The second step in the sequence
Freescale Semiconductor
.
1. V
2. V
Table 2-1
1
2
DDH
DDH
Power-Up/Down Sequencing
(High Voltage Supply Group)
(Low Voltage Supply Pins)
These power supplies are only available on the MPC563 and MPC564.
Any supply in the V
required during “Keep-alive.”
(Low Voltage Keep-Alive
Power-Up/Down Option A
≤
≥
The V
rate less that 25V/ms.
V
V
Supply Pins
DDL
DDL
Symbol
for a list of 2.6 V and dual 2.6V/5 V compliant pins.
V
V
V
DDKA
DDH
DDL
DDH
+ 3.1 V (V
- 0.5 V (V
ramp voltage should be kept below 50V/ms and the V
2
DDKA
group can be powered with the V
DDH
MPC561/MPC563 Reference Manual, Rev. 1.2
DDH
Table F-9. Power Supply Pin Groups
Supply to the 5-V pads for output driver (V
Supply to the analog (QADC64E) circuitry (V
High voltage supply to the flash module (V
Supply to low voltage pad drivers (QVDDL, NVDDL)
Supply to all low voltage internal logic (V
Supply to low voltage flash circuitry (V
Supply to system PLL
Supply to IRAMSTBY
Supply to oscillator and other circuitry for keep-alive functions (KAPWR).
cannot lag V
cannot lead V
DDKA
DDL
DDL
NOTE:
) is
by more than 0.5 V)
Types of Power Pins
by more than 3.1 V)
Table
DDL
if the function which it supplies is not
F-9.
DDF
DD
)
DDH
FLASH
1
)
DDA
)
)
)
1
DDL
ramp
Electrical Characteristics
F-13