MPC564MZP56 Freescale Semiconductor, MPC564MZP56 Datasheet - Page 26

IC MCU 512K FLASH 56MHZ 388-BGA

MPC564MZP56

Manufacturer Part Number
MPC564MZP56
Description
IC MCU 512K FLASH 56MHZ 388-BGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Datasheets

Specifications of MPC564MZP56

Core Processor
PowerPC
Core Size
32-Bit
Speed
56MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
56
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
388-BGA
Core
PowerPC
Processor Series
MPC5xx
Data Bus Width
32 bit
Maximum Clock Frequency
56 MHz
Data Ram Size
32 KB
On-chip Adc
Yes
Number Of Programmable I/os
56
Number Of Timers
2
Operating Supply Voltage
0 V to 5 V
Mounting Style
SMD/SMT
A/d Bit Size
10 bit
A/d Channels Available
32
Height
1.95 mm
Interface Type
CAN, JTAG, QSPI, SCI, SPI, UART
Length
27 mm
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Supply Voltage (max)
2.7 V, 5.25 V
Supply Voltage (min)
2.5 V, 4.75 V
Width
27 mm
For Use With
MPC564EVB - KIT EVAL FOR MPC561/562/563/564
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No RoHS Version Available

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19.2.2
19.2.3
19.2.4
19.2.5
19.2.6
19.3
19.3.1
19.3.2
19.3.3
19.3.4
19.3.5
19.3.6
19.3.7
19.3.8
19.3.9
19.4
19.4.1
19.4.2
19.4.3
19.4.4
19.4.5
19.4.6
19.4.7
19.4.8
19.4.9
19.4.10
19.4.11
19.4.12
19.4.13
19.4.14
19.4.15
19.5
20.1
20.2
20.3
20.3.1
20.3.2
Freescale Semiconductor
Paragraph
Number
TPU Operation .............................................................................................................. 19-3
Programming Model ..................................................................................................... 19-8
Time Functions ........................................................................................................... 19-23
Features ......................................................................................................................... 20-1
DPTRAM Configuration Block Diagram ..................................................................... 20-2
Programming Model ..................................................................................................... 20-2
Timer Channels ......................................................................................................... 19-2
Scheduler .................................................................................................................. 19-2
Microengine .............................................................................................................. 19-3
Host Interface ............................................................................................................ 19-3
Parameter RAM ........................................................................................................ 19-3
Event Timing ............................................................................................................ 19-3
Channel Orthogonality .............................................................................................. 19-4
Interchannel Communication .................................................................................... 19-4
Programmable Channel Service Priority .................................................................. 19-4
Coherency ................................................................................................................. 19-4
Emulation Support .................................................................................................... 19-4
TPU3 Interrupts ........................................................................................................ 19-5
Prescaler Control for TCR1 ...................................................................................... 19-5
Prescaler Control for TCR2 ...................................................................................... 19-7
TPU Module Configuration Register (TPUMCR) ................................................. 19-11
Development Support Control Register (DSCR) .................................................... 19-12
Development Support Status Register (DSSR) ...................................................... 19-13
TPU3 Interrupt Configuration Register (TICR) ..................................................... 19-14
Channel Interrupt Enable Register (CIER) ............................................................. 19-15
Channel Function Select Registers (CFSRn) .......................................................... 19-15
Host Sequence Registers (HSQRn) ........................................................................ 19-16
Host Service Request Registers (HSRRn) ............................................................. 19-17
Channel Priority Registers (CPRx) ......................................................................... 19-18
Channel Interrupt Status Register (CISR) .............................................................. 19-19
TPU3 Module Configuration Register 2 (TPUMCR2) ........................................... 19-19
TPU Module Configuration Register 3 (TPUMCR3) ............................................. 19-21
SIU Test Register (SIUTST) ................................................................................... 19-22
Factory Test Registers ............................................................................................ 19-22
TPU3 Parameter RAM ............................................................................................ 19-23
DPTRAM Module Configuration Register (DPTMCR) ......................................... 20-3
DPTRAM Test Register (DPTTCR) ......................................................................... 20-4
Dual-Port TPU3 RAM (DPTRAM)
MPC561/MPC563 Reference Manual, Rev. 1.2
Contents
Chapter 20
Title
Number
Page
xxvi

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