MPC564MZP56 Freescale Semiconductor, MPC564MZP56 Datasheet - Page 1309

• Manufacturer Part Number: MPC564MZP56
• Description: IC MCU 512K FLASH 56MHZ 388-BGA
• Manufacturer: Freescale Semiconductor
• Series: MPC5xxr

Specifications of MPC564MZP56

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 56MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 56
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 32x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 388-BGA
• Core: PowerPC
• Processor Series: MPC5xx
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 56 MHz
• Data Ram Size: 32 KB
• On-chip Adc: Yes
• Number Of Programmable I/os: 56
• Number Of Timers: 2
• Operating Supply Voltage: 0 V to 5 V
• Mounting Style: SMD/SMT
• A/d Bit Size: 10 bit
• A/d Channels Available: 32
• Height: 1.95 mm
• Interface Type: CAN, JTAG, QSPI, SCI, SPI, UART
• Length: 27 mm
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Supply Voltage (max): 2.7 V, 5.25 V
• Supply Voltage (min): 2.5 V, 4.75 V
• Width: 27 mm
• For Use With: MPC564EVB - KIT EVAL FOR MPC561/562/563/564
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No RoHS Version Available

This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., either V
G.2
The MPC561/MPC563 is available in packaged form. The package is a 388-ball PBGA having a 1.0 mm
ball pitch, Freescale case outline 1164-01 (See
G.3
G.3.1
The document referenced for the EMC testing of MPC561/MPC563 is SAE J1752/3 Issued 1995-03
G.3.2
EMC – Electromagnetic Compatibility
EMI – Electromagnetic Interference
TEM cell – Transverse Electromagnetic Mode cell
G.3.3
G.4
Freescale Semiconductor
1. Scan range: 150 KHz – 1000 MHz
2. Operating Frequency: 66 MHz
3. Operating Voltages: 2.6 V, 5.0 V
4. Max spikes: TBD dBuV
5. I/O port waveforms: Per J1752/3
6. Temperature: 25 °C
BGA Package Thermal Resistance,
Junction to Ambient – Natural Convection
BGA Package Thermal Resistance,
Junction to Ambient – Four layer (2s2p) board, natural
convection
Package
EMI Characteristics
Thermal Characteristics
Reference Documents
Definitions and Acronyms
EMI Testing Specifications
Negative current flows out of the pin and positive current flows into the pin.
Characteristic
MPC561/MPC563 Reference Manual, Rev. 1.2
Table G-2. Thermal Characteristics
Figure G-63
NOTE
Symbol
R
R
θJMA
and
θJA
Figure
SS
or V
G-64).
47.3
29.4
DD
Value
).
1,2,3
3,4
,
5
66-MHz Electrical Characteristics
°C/W
°C/W
Unit
G-3