MC68HC711PH8 Motorola, MC68HC711PH8 Datasheet - Page 226

• Manufacturer Part Number: MC68HC711PH8
• Description: High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit
• Manufacturer: Motorola

12
where:
An approximate relationship between P
Solving equations [1] and [2] for K gives:
where K is a constant for a particular part. K can be determined by measuring P
for a known T
by solving the above equations. The package thermal characteristics are shown below:
MOTOROLA
A-2
A
. Using this value of K, the values of P
P
P
INT
P
T
I/O
JA
D
A
= Ambient temperature ( C)
= Package thermal resistance, junction-to-ambient ( C/W)
= Total power dissipation = P
= Internal chip power = I
= Power dissipation on input and output pins (user determined)
Thermal resistance
Ð 84-pin PLCC package
Ð 84-pin CERQUAD package (EPROM)
Ð 112-pin QFP package
ELECTRICAL SPECIFICATIONS (STANDARD)
Characteristics
K
=
P
T
J
D
D
P
=
D
and T
T
T
A
=
A
DD
+
+
-------------------- -
T
J
273
J
P
• V
(if P
+
K
D
INT
273
DD
+
D
I/O
+ P
and T
Symbol
JA
(W)
JA
is neglected) is:
JA
I/O
P
J
(W)
D
can be obtained for any value of T
2
Value
TBD
50
50
Unit
C/W
D
MC68HC11PH8
(at equilibrium)
[1]
[2]
[3]
A
,
TPG