DF2218BR24V Renesas Electronics America, DF2218BR24V Datasheet - Page 208

IC H8S/2218 MCU FLASH 112-LFBGA

DF2218BR24V

Manufacturer Part Number
DF2218BR24V
Description
IC H8S/2218 MCU FLASH 112-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheets

Specifications of DF2218BR24V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
69
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
112-LFBGA
For Use With
HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW3DK2218 - DEV EVAL KIT H8S/2218
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2218BR24V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Table 6.4 shows pin states in an idle cycle.
Table 6.4
Rev.7.00 Dec. 24, 2008 Page 152 of 698
REJ09B0074-0700
Pins
A23 to A0
D15 to D0
CSn
AS
RD
HWR
LWR
Address bus
CS (area A)
CS (area B)
Pin States in Idle Cycle
Figure 6.24 Relationship between Chip Select (CS) and Read (RD)
RD
φ
Possibility of overlap between
CS (area B) and RD
T
(a) Idle cycle not inserted
1
Bus cycle A
(ICIS1 = 0)
T
2
T
3
Bus cycle B
T
1
T
2
Address bus
CS (area A)
CS (area B)
Pin State
Contents of next bus cycle
High impedance
High
High
High
High
High
RD
φ
T
1
Bus cycle A
(b) Idle cycle inserted
(Initial value ICIS1 = 1)
T
2
T
3
T
Bus cycle B
I
T
1
T
2

Related parts for DF2218BR24V