DF2218BR24V Renesas Electronics America, DF2218BR24V Datasheet - Page 747

• Manufacturer Part Number: DF2218BR24V
• Description: IC H8S/2218 MCU FLASH 112-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2218BR24V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 24MHz
• Connectivity: SCI, SmartCard, USB
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 69
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 12K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 6x10b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 112-LFBGA
• For Use With: HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)3DK2218-SS - KIT DEV H8S/2218 WINDOWS SIDESHW3DK2218 - DEV EVAL KIT H8S/2218
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

C.
The package dimension that is shown in the Renesas Semiconductor Package Data Book has
priority.
P-TQFP100-12x12-0.40
JEITA Package Code
Package Dimensions
100
76
Figure C.1 TFP-100G and TFP-100GV Package Dimensions
Z
e
D
75
1
RENESAS Code
PTQP0100LC-A
Index mark
*1
H
D
D
y
TFP-100G/TFP-100GV
*3
b
p
Previous Code
51
25
x
50
26
F
M
MASS[Typ.]
0.4g
Rev.7.00 Dec. 24, 2008 Page 691 of 698
Terminal cross section
Detail F
b
b
p
1
L
1
L
θ
REJ09B0074-0700
NOTE)
1. DIMENSIONS"*1"AND"*2"
2. DIMENSION"*3"DOES NOT
DO NOT INCLUDE MOLD FLASH
INCLUDE TRIM OFFSET.
Reference
Symbol
e
D
E
A
H
H
A
A
b
b
c
c
θ
x
y
Z
Z
L
L
p
1
1
1
D
E
2
D
E
1
Dimension in Millimeters
13.8 14.0 14.2
13.8
0.00 0.10 0.20
0.13 0.18 0.23
0.12 0.17 0.22
Min Nom Max
0.4
0°
1.00
14.0
0.16
0.15
0.4
1.2
1.2
0.5
1.0
12
12
14.2
1.20
0.07
0.10
0.6
8°