SC2200 NSC [National Semiconductor], SC2200 Datasheet - Page 428

• Manufacturer Part Number: SC2200
• Description: Thin Client On a Chip
• Manufacturer: NSC [National Semiconductor]

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9.0
The figures in this section provide the mechanical package outlines for the 432-Terminal EBGA (Enhanced Ball Grid Array)
and 481-Terminal TEPBGA (Thermally Enhanced Ball Grid Array) packages.
NOTES: UNLESS OTHERWISE SPECIFIED.
1)
2)
3)
4)
SOLDER BALL COMPOSITION: SN 63%, PB 37%.
DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N.
REFERENCE JEDEC REGISTRATION MO-151, VARIATION -1.00, DATED JUNE 1997.
THETA JUNCTION TO CASE (T
Package Specifications
Figure 9-1. 432-Terminal EBGA Package (Body Size: 40x40x1.72 mm; Pitch: 1.27 mm)
JC
) = 1°C/WATT.
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