SC2200 NSC [National Semiconductor], SC2200 Datasheet - Page 429

• Manufacturer Part Number: SC2200
• Description: Thin Client On a Chip
• Manufacturer: NSC [National Semiconductor]

Revision 3.0
Package Specifications
NOTES: UNLESS OTHERWISE SPECIFIED.
1)
2)
3)
4)
5)
SOLDER BALL COMPOSITION: SN 63%, PB 37%.
DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N.
THE MOLD SURFACE AREA MAY INCLUDE DIMPLE FOR A1 BALL CORNER IDENTIFICATION.
REFERENCE JEDEC REGISTRATION MS-034, VARIATION BAU-1.
THETA JUNCTION TO CASE (T
Figure 9-2. 481-Terminal TEPBGA Package (Body Size: 40x40x2.38 mm; Pitch: 1.27 mm)
(Continued)
JC
) = 5°C/WATT.
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