EP4SGX530HH35C2N Altera, EP4SGX530HH35C2N Datasheet - Page 221

• Manufacturer Part Number: EP4SGX530HH35C2N
• Description: IC STRATIX IV FPGA 530K 1152HBGA
• Manufacturer: Altera
• Series: Stratix® IV GXr

Specifications of EP4SGX530HH35C2N

• Number Of Logic Elements/cells: 531200
• Number Of Labs/clbs: 21248
• Total Ram Bits: 27376
• Number Of I /o: 564
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 1152-HBGA
• Family Name: Stratix® IV
• Number Of Logic Blocks/elements: 531200
• # Registers: 424960
• # I/os (max): 560
• Process Technology: 40nm
• Operating Supply Voltage (typ): 900mV
• Logic Cells: 531200
• Ram Bits: 28033024
• Operating Supply Voltage (min): 0.87V
• Operating Supply Voltage (max): 0.93V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 1152
• Package Type: FCHBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Gates: -
• Lead Free Status / Rohs Status: Compliant

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SIV51007-3.2
Stratix IV Device Handbook Volume 1
February 2011
February 2011
SIV51007-3.2
f
This chapter describes external memory interfaces available with the Stratix
device family and that family’s silicon capability to support external memory
interfaces. To support the level of system bandwidth achievable with Altera
Stratix IV FPGAs, the devices provide an efficient architecture to quickly and easily fit
wide external memory interfaces within their small modular I/O bank structure. The
I/Os are designed to provide high-performance support for existing and emerging
external double data rate (DDR) memory standards, such as DDR3, DDR2, DDR
SDRAM, QDR II+, QDR II SRAM, and RLDRAM II.
Stratix IV I/O elements provide easy-to-use built-in functionality required for a rapid
and robust implementation with features such as dynamic calibrated on-chip
termination (OCT), trace mismatch compensation, read- and write-leveling circuit for
DDR3 SDRAM interfaces, half data rate (HDR) blocks, and 4- to 36-bit programmable
DQ group widths.
The high-performance memory interface solution is backed-up by a self-calibrating
megafunction (ALTMEMPHY), optimized to take advantage of the Stratix IV I/O
structure and the TimeQuest Timing Analyzer, which completes the picture by
providing the total solution for the highest reliable frequency of operation across
process, voltage, and temperature (PVT) variations.
This chapter contains the following sections:
■
■
For more information about external memory system performance specifications,
board design guidelines, timing analysis, simulation, and debugging information,
refer to the
“Memory Interfaces Pin Support” on page 7–3
“Stratix IV External Memory Interface Features” on page 7–29
External Memory Interface
7. External Memory Interfaces in
Handbook.
Stratix IV Devices
®
®
IV
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