SAM9G45 Atmel Corporation, SAM9G45 Datasheet - Page 131

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SAM9G45

Manufacturer Part Number
SAM9G45
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM9G45

Flash (kbytes)
0 Kbytes
Pin Count
324
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
160
Ext Interrupts
160
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
2
Uart
5
Lin
4
Ssc
2
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
Yes
Adc Channels
8
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
64
Self Program Memory
NO
External Bus Interface
2
Dram Memory
DDR2/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No/Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
ARM DDI0198D
ARM926EJ-S
Optimizing for speed
Figure 5-15 on page 5-24 shows how to produce a large memory from two smaller
RAM blocks if you are optimizing for speed. Separate write enable control is required
for each RAM block:
WE_bank0 = ~DRADDR[14] & DRnRW
WE_bank1 = DRADDR[14] & DRnRW
No logic is added to the critical DRCS path, but both RAMs are enabled whenever
DRCS is asserted, resulting in higher power consumption.
DRADDR[17:0]
DRWD[31:0]
DRWBL[3:0]
DRSIZE[3:0]
DRRD[31:0]
Copyright © 2001-2003 ARM Limited. All rights reserved.
DRWAIT
DRnRW
DRIDLE
DRSEQ
DRCS
b1000
DRADDR[14]
CLK
DIN[31:0]
CLK
WE
CS DOUT[31:0]
RAM 64KB
A[13:0]
Bank 1
DRADDR[13:0]
BW[3:0]
Figure 5-14 Optimizing for power
Tightly-Coupled Memory Interface
DIN[31:0]
CLK
WE
CS DOUT[31:0]
RAM 64KB
A[13:0]
Bank 0
DRADDR[13:0]
BW[3:0]
5-23

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