DF2505BR26DV Renesas Electronics America, DF2505BR26DV Datasheet - Page 187

IC H8S/2505 MCU FLASH 176-LFBGA

DF2505BR26DV

Manufacturer Part Number
DF2505BR26DV
Description
IC H8S/2505 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Datasheets

Specifications of DF2505BR26DV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2505BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
7.5
The CPU is driven by a system clock, denoted by the symbol φ. The period from one rising edge
of φ to the next is referred to as a "state." The memory cycle or bus cycle consists of one, two, or
three states. Different methods are used to access on-chip memory, on-chip peripheral modules,
and the external address space.
7.5.1
On-chip memory is accessed in one state. The data bus width is 16 bits, enabling both byte and
word transfer. Figure 7.4 shows the on-chip memory access cycle. Figure 7.5 shows the pin states.
Basic Timing
On-Chip Memory (ROM, RAM) Access Timing
Internal address bus
φ
Read
Write
Figure 7.4 On-Chip Memory Access Cycle
Internal read signal
Internal data bus
Internal write signal
Internal data bus
Bus cycle
Address
T
1
Rev. 6.00 Sep. 24, 2009 Page 139 of 928
Read data
Write data
Section 7 Bus Controller
REJ09B0099-0600

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