DF2505BR26DV Renesas Electronics America, DF2505BR26DV Datasheet - Page 48

• Manufacturer Part Number: DF2505BR26DV
• Description: IC H8S/2505 MCU FLASH 176-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2500r

Specifications of DF2505BR26DV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 26MHz
• Connectivity: I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 104
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 20.25 AC Characteristics in Status-Read Mode................................................................ 772
Table 20.26 Transition Time Rules before Command Wait State .............................................. 773
Section 21 Clock Pulse Generator
Table 21.1
Table 21.2
Table 21.3
Section 22 Power-Down Modes
Table 22.1
Table 22.2
Table 22.3
Table 22.4
Section 24 Electrical Characteristics
Table 24.1
Table 24.2
Table 24.2
Table 24.2
Table 24.3
Table 24.4
Table 24.5
Table 24.6
Table 24.6
Table 24.7
Table 24.8
Table 24.9
Table 24.10 I
Table 24.11 A/D Conversion Characteristics.............................................................................. 903
Table 24.12 D/A Conversion Characteristics.............................................................................. 904
Table 24.13 Flash Memory Characteristics................................................................................. 905
Rev. 6.00 Sep. 24, 2009 Page xlvi of xlvi
REJ09B0099-0600
Damping Resistance Value ..................................................................................... 780
Crystal Resonator Characteristics ........................................................................... 781
External Clock Input Conditions............................................................................. 782
LSI Internal States in Each Mode ........................................................................... 791
Power-Down Mode Transition Conditions ............................................................. 795
Oscillation Settling Time Settings........................................................................... 802
φ Pin State in Each Processing State ....................................................................... 807
Absolute Maximum Ratings.................................................................................... 873
DC Characteristics (1)............................................................................................. 874
DC Characteristics (2)............................................................................................. 876
DC Characteristics (3)............................................................................................. 878
Permissible Output Currents ................................................................................... 880
Bus Drive Characteristics........................................................................................ 881
Power-On/Off Timing............................................................................................. 882
Clock Timing (1)..................................................................................................... 884
Clock Timing (2)..................................................................................................... 885
Control Signal Timing............................................................................................. 886
Bus Timing.............................................................................................................. 889
Timing of On-Chip Peripheral Modules ................................................................. 895
2
C Bus Interface 2 Timing...................................................................................... 901