DF2505BR26DV Renesas Electronics America, DF2505BR26DV Datasheet - Page 188

IC H8S/2505 MCU FLASH 176-LFBGA

DF2505BR26DV

Manufacturer Part Number
DF2505BR26DV
Description
IC H8S/2505 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Datasheets

Specifications of DF2505BR26DV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2505BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 7 Bus Controller
7.5.2
On-Chip Peripheral Module Access Timing Excluding Port H, Port J, IIC2, IEB, and
HCAN: The on-chip peripheral modules are accessed in two states except for port H, port J, IIC2,
IEB, and HCAN. The data bus width is either 8 bits or 16 bits, depending on the particular internal
I/O register being accessed. Figure 7.6 shows the access timing for the on-chip peripheral
modules. Figure 7.7 shows the pin states.
Rev. 6.00 Sep. 24, 2009 Page 140 of 928
REJ09B0099-0600
On-Chip Peripheral Module Access Timing
Internal address bus
φ
Read
Write
Figure 7.5 Pin States during On-Chip Memory Access
Figure 7.6 On-Chip Peripheral Module Access Cycle
Internal read signal
Internal data bus
Internal write signal
Internal data bus
Address bus
AS
RD
HWR, LWR
Data bus
High impedance
Bus cycle
Retained
High
High
High
T
1
T
1
Bus cycle
Address
Write data
Read data
T
2

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