DF2505BR26DV Renesas Electronics America, DF2505BR26DV Datasheet - Page 934

• Manufacturer Part Number: DF2505BR26DV
• Description: IC H8S/2505 MCU FLASH 176-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2500r

Specifications of DF2505BR26DV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 26MHz
• Connectivity: I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 104
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 24 Electrical Characteristics
24.4.3
Table 24.7 lists the control signal timing.
Table 24.7 Control Signal Timing
Condition A
V
3.3 V ± 0.3 V (BUFGC1 and BUFGC2 in ICPCR are 1),
AV
8 to 26 MHz, T
specifications)
Condition B
V
3.3 V ± 0.3 V (BUFGC1 and BUFGC2 in ICPCR are 1),
AV
8 to 20 MHz, Ta = –40°C to +85°C (wide-range specifications)
Rev. 6.00 Sep. 24, 2009 Page 886 of 928
REJ09B0099-0600
Item
RES setup time
RES pulse width
MRES setup time
MRES pulse width
CC
CC
CC
CC
= P1V
= P1V
= 3.0 V to 5.5 V, V
= 3.0 V to 5.5 V, V
Control Signal Timing
CC
CC
EXTAL
V
P1V
P2V
STBY
RES
φ
CC
= P2V
= P2V
CC
CC
a
= –20°C to +75°C (regular specifications)*, T
(for H8S/2552 Group, H8S/2506 Group):
(for H8S/2556 Group):
CC
CC
= 5.0 V ± 0.5 V (BUFGC1 and BUFGC2 in ICPCR are 0)/
= 5.0 V ± 0.5 V (BUFGC1 and BUFGC2 in ICPCR are 0)/
t
OSC1
ref
ref
t
DEXT
= 3.0 V to AV
= 3.0 V to AV
Figure 24.6 Oscillator Settling Timing
Symbol Min.
t
t
t
t
RESS
RESW
MRESS
MRESW
CC
CC
, V
, V
SS
SS
= AV
= AV
250
20
250
20
SS
SS
= 0 V, φ= 32.768 kHz,
= 0 V, φ= 32.768 kHz,
Max.
—
—
—
—
a
= –40°C to +85°C (wide-range
Unit
ns
t
ns
t
cyc
cyc
t
OSC1
t
DEXT
Test Conditions
Figure 24.7