DF2505BR26DV Renesas Electronics America, DF2505BR26DV Datasheet - Page 933

• Manufacturer Part Number: DF2505BR26DV
• Description: IC H8S/2505 MCU FLASH 176-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2500r

Specifications of DF2505BR26DV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 26MHz
• Connectivity: I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 104
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 24.6 Clock Timing (2)
Conditions
V
(BUFGC1 and BUFGC2 in ICPCR are 1),
AV
8 to 20 MHz, Ta = –40°C to +85°C (wide-range specifications)
Item
Clock cycle time
Clock high pulse width
Clock low pulse width
Clock rise time
Clock fall time
EXTAL clock input
frequency
Clock oscillator settling time at reset
(crystal)
Clock oscillator settling time at reset
(external clock)
Clock oscillator settling time in
software standby (crystal)
External clock settling delay time
Subclock oscillator settling time
Subclock oscillator frequency
Subclock (φ
CC
CC
= P1V
= 3.0 V to 5.5 V, V
CC
SUB
= P2V
) cycle time
(for H8S/2556 Group):
CC
PLL1
multiplication
PLL2
multiplication
= 5.0 V ±0.5 V (BUFGC1 and BUFGC2 in ICPCR are 0)/ 3.3 V ±0.3 V
ref
= 3.0 V to AV
φ
Figure 24.5 System Clock Timing
Symbol Min.
t
t
t
t
t
f
t
t
t
t
f
t
cyc
CH
CL
Cr
Cf
EX
OSC1
OSC2
DEXT
OSC3
SUB
SUB
CC
t
, V
CH
SS
t
cyc
= AV
t
50
18
18
⎯
⎯
8
8
20
20
8
8
2
Cf
t
CL
SS
32.768
= 0 V, φ= 32.768 kHz,
30.5
t
Cr
Max.
125
⎯
⎯
5
5
20
10
⎯
⎯
⎯
⎯
⎯
Rev. 6.00 Sep. 24, 2009 Page 885 of 928
Section 24 Electrical Characteristics
Unit
ns
ns
ns
ns
ns
MHz
ms
ms
ms
ms
s
kHz
μs
Test Conditions
Figure 24.5
Figure 21.5
Figure 24.6
Figure 22.3
Figure 24.6
REJ09B0099-0600