DF2505BR26DV Renesas Electronics America, DF2505BR26DV Datasheet - Page 767

• Manufacturer Part Number: DF2505BR26DV
• Description: IC H8S/2505 MCU FLASH 176-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2500r

Specifications of DF2505BR26DV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 26MHz
• Connectivity: I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 104
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

In consideration of these conditions, there are three factors; operating mode, the bank structure of
the user MAT, and operations.
The areas in which the programming data can be stored for execution are shown in tables.
Table 20.8 Executable MAT
Note:
Table 20.9 (1)
Operation
Programming
Erasing
Item
Storage Area for
Program Data
Operation for Selection
of On-chip Program to
be Downloaded
Operation for Writing
H'A5 to FKEY
Execution of Writing
SCO = 1 to FCCS
(Download)
Operation for FKEY
Clear
should be transferred to the on-chip RAM to place the address that FMPDR indicates in an
area other than the flash memory.
*
Programming/Erasing is possible to user MATs.
Useable Area for Programming in User Program Mode
On-Chip
RAM
User Program Mode
Table 20.9 (1)
Table 20.9 (2)
Storable /Executable Area
Target Flash
Memory
×*
×
External Space
(Expanded Mode) User MAT
Initiated Mode
×
Rev. 6.00 Sep. 24, 2009 Page 719 of 928
User Boot Mode*
Table 20.9 (3)
Table 20.9 (4)
Section 20 Flash Memory
⎯
Selected MAT
REJ09B0099-0600
Embedded
Program
Storage Area
⎯