DF2398TE20 Renesas Electronics America, DF2398TE20 Datasheet - Page 603

• Manufacturer Part Number: DF2398TE20
• Description: IC H8S MCU FLASH 256K 120TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2398TE20

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 87
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 120-TQFP, 120-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2398TE20; HD64F2398TE20

19.5.4
Reliability of Programmed Data
An effective way to assure the data retention characteristics of the programmed chips is to bake them at 150 C, then
screen them for data errors. This procedure quickly eliminates chips with PROM memory cells prone to early failure.
Figure 19-6 shows the recommended screening procedure.
Program chip and verify data
Bake chip for 24 to 48 hours at
125 C to 150 C with power off
Read and check program
Mount
Figure 19-6 Recommended Screening Procedure
If a series of programming errors occurs while the same PROM programmer is being used, stop programming and check
the PROM programmer and socket adapter for defects.
Please inform Renesas Technology of any abnormal conditions noted during or after programming or in screening of
program data after high-temperature baking.
Rev.6.00 Oct.28.2004 page 573 of 1016
REJ09B0138-0600H