MC9S08JM60CLH Freescale, MC9S08JM60CLH Datasheet - Page 30
MC9S08JM60CLH
Manufacturer Part Number
MC9S08JM60CLH
Description
Manufacturer
Freescale
Datasheet
1.MC9S08JM60CLH.pdf
(388 pages)
Specifications of MC9S08JM60CLH
Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
24MHz
Interface Type
SCI/SPI
Total Internal Ram Size
4KB
# I/os (max)
51
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
On-chip Adc
12-chx12-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Package Type
LQFP
Program Memory Type
Flash
Program Memory Size
60KB
Lead Free Status / RoHS Status
Compliant
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Chapter 2 Pins and Connections
2.3.1
V
I/O buffer circuitry and to an internal voltage regulator. The internal voltage regulator provides regulated
lower-voltage source to the CPU and other internal circuitry of the MCU.
Typically, application systems have two separate capacitors across the power pins. In this case, there must
be a bulk electrolytic capacitor, such as a 10-μF tantalum capacitor, to provide bulk charge storage for the
overall system and a 0.1-μF ceramic bypass capacitor located as near to the paired V
pins as practical to suppress high-frequency noise. The MC9S08JM60 series have a V
must be connected to the system ground plane or to the primary V
connection.
V
the ADC module. A 0.1-μF ceramic bypass capacitor must be located as near to the analog power pins as
practical to suppress high-frequency noise.
V
can only source enough current for internal USB transceiver and USB pullup resistor. Two separate
capacitors (4.7-μF bulk electrolytic stability capacitor and 0.47-μF ceramic bypass capacitors) must be
connected across this pin to ground to decrease the output ripple of this voltage regulator when it is
enabled.
2.3.2
Immediately after reset, the MCU uses an internally generated clock provided by the multi-purpose clock
generator (MCG) module. For more information on the MCG, see
Generator
The oscillator (XOSC) in this MCU is a Pierce oscillator that can accommodate a crystal or ceramic
resonator. Rather than a crystal or ceramic resonator, an external oscillator can be connected to the EXTAL
input pin.
R
Wire-wound resistors, and some metal film resistors, have too much inductance. C1 and C2 normally must
be high-quality ceramic capacitors that are specifically designed for high-frequency applications.
R
is not generally critical. Typical systems use 1 MΩ to 10 MΩ. Higher values are sensitive to humidity and
lower values reduce gain and (in extreme cases) could prevent startup.
C1 and C2 are typically in the 5-pF to 25-pF range and are chosen to match the requirements of a specific
crystal or resonator. Be sure to take into account printed circuit board (PCB) capacitance and MCU pin
capacitance when selecting C1 and C2. The crystal manufacturer typically specifies a load capacitance
which is the series combination of C1 and C2 (which are usually the same size). As a first-order
approximation, use 10 pF as an estimate of combined pin and PCB capacitance for each oscillator pin
(EXTAL and XTAL).
30
S
F
DD
DDAD
USB33
is used to provide a bias path to keep the EXTAL input in its linear range during crystal startup; its value
(when used) and R
and V
and V
is connected to the internal USB 3.3-V regulator. V
(S08MCGV1).”
SS
Power (V
Oscillator (XTAL, EXTAL)
SSAD
are the primary power supply pins for the MCU. This voltage source supplies power to all
are the analog power supply pins for the MCU. This voltage source supplies power to
F
must be low-inductance resistors such as carbon composition resistors.
DD
, V
SS
, V
MC9S08JM60 Series Data Sheet, Rev. 3
SSOSC
, V
DDAD
, V
USB33
SSAD
maintains an output voltage of 3.3 V and
, V
SS
Chapter 12, “Multi-Purpose Clock
pin through a low-impedance
USB33
)
Freescale Semiconductor
DD
SSOSC
and V
pin. This pin
SS
power
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