MC9S08JM60CLH Freescale, MC9S08JM60CLH Datasheet - Page 327

MC9S08JM60CLH

Manufacturer Part Number
MC9S08JM60CLH
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S08JM60CLH

Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
24MHz
Interface Type
SCI/SPI
Total Internal Ram Size
4KB
# I/os (max)
51
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
On-chip Adc
12-chx12-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Package Type
LQFP
Program Memory Type
Flash
Program Memory Size
60KB
Lead Free Status / RoHS Status
Compliant

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Chapter 18
Development Support
18.1
Introduction
Development support systems in the HCS08 include the background debug controller (BDC) and the
on-chip debug module (DBG). The BDC provides a single-wire debug interface to the target MCU that
provides a convenient interface for programming the on-chip flash and other nonvolatile memories. The
BDC is also the primary debug interface for development and allows non-intrusive access to memory data
and traditional debug features such as CPU register modify, breakpoints, and single instruction trace
commands.
In the HCS08 family, address and data bus signals are not available on external pins (not even in test
modes). Debug is done through commands fed into the target MCU via the single-wire background debug
interface. The debug module provides a means to selectively trigger and capture bus information so an
external development system can reconstruct what happened inside the MCU on a cycle-by-cycle basis
without having external access to the address and data signals.
The alternate BDC clock source for MC9S08JM60 Series is the MCGLCLK. See
Chapter 12,
“Multi-Purpose Clock Generator
(S08MCGV1),” for more information about MCGLCLK and how to
select clock sources.
MC9S08JM60 Series Data Sheet, Rev. 3
Freescale Semiconductor
327

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