MC9S08JM60CLH Freescale, MC9S08JM60CLH Datasheet - Page 332

MC9S08JM60CLH

Manufacturer Part Number
MC9S08JM60CLH
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S08JM60CLH

Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
24MHz
Interface Type
SCI/SPI
Total Internal Ram Size
4KB
# I/os (max)
51
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
On-chip Adc
12-chx12-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Package Type
LQFP
Program Memory Type
Flash
Program Memory Size
60KB
Lead Free Status / RoHS Status
Compliant

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Development Support
Figure 18-3
shows the host receiving a logic 1 from the target HCS08 MCU. Because the host is
asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on
BKGD to the perceived start of the bit time in the target MCU. The host holds the BKGD pin low long
enough for the target to recognize it (at least two target BDC cycles). The host must release the low drive
before the target MCU drives a brief active-high speedup pulse seven cycles after the perceived start of the
bit time. The host should sample the bit level about 10 cycles after it started the bit time.
BDC CLOCK
(TARGET MCU)
HOST DRIVE
HIGH-IMPEDANCE
TO BKGD PIN
TARGET MCU
SPEEDUP PULSE
HIGH-IMPEDANCE
HIGH-IMPEDANCE
PERCEIVED START
OF BIT TIME
R-C RISE
BKGD PIN
10 CYCLES
EARLIEST START
OF NEXT BIT
10 CYCLES
HOST SAMPLES BKGD PIN
Figure 18-3. BDC Target-to-Host Serial Bit Timing (Logic 1)
MC9S08JM60 Series Data Sheet, Rev. 3
332
Freescale Semiconductor

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