DEMO9S12XEP100 Freescale Semiconductor, DEMO9S12XEP100 Datasheet - Page 213

• Manufacturer Part Number: DEMO9S12XEP100
• Description: BOARD DEMO FOR MC9S12XEP100
• Manufacturer: Freescale Semiconductor
• Type: MCUr

Specifications of DEMO9S12XEP100

• Contents: Board, Cables, CD
• Processor To Be Evaluated: MC9S12XEP100
• Data Bus Width: 16 bit
• Interface Type: RS-232
• Silicon Manufacturer: Freescale
• Core Architecture: S12
• Core Sub-architecture: S12
• Silicon Core Number: MC9S12
• Silicon Family Name: S12XE
• Rohs Compliant: Yes
• For Use With/related Products: MC9S12XEP100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

3.4.2.3
The global memory spaces reserved for the internal resources (RAM, EEE, and FLASH) are not
determined by the MMC module. Size of the individual internal resources are however fixed in the design
of the device cannot be changed by the user. Please refer to the Device User Guide for further details.
Figure 3-19
the memory spaces have fixed top addresses.
When the device is operating in expanded modes except emulation single-chip mode, accesses to global
addresses which are not occupied by the on-chip resources (unimplemented areas or external memory
space) result in accesses to the external bus (see
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Bit22
Bit22
and
Implemented Memory Map
Table 3-17
BDMGPR Register [6:0]
BDMGPR Register [6:0]
1. RAMSIZE is the hexadecimal value of RAM SIZE in bytes
2. FLASHSIZE is the hexadecimal value of FLASH SIZE in bytes
Internal Resource
FLASH
show the memory spaces occupied by the on-chip resources. Please note that
RAM
Table 3-17. Global Implemented Memory Space
MC9S12XE-Family Reference Manual Rev. 1.23
Figure 3-18. BDMGPR Address Mapping
BDM HARDWARE COMMAND
BDM FIRMWARE COMMAND
Global Address [22:0]
Global Address [22:0]
Bit16
Bit16
FLASH_LOW = 0x80_0000 minus FLASHSIZE
RAM_LOW = 0x10_0000 minus RAMSIZE
Bit15
Bit15
Figure
3-19).
$Address
BDM Local Address
Chapter 3 Memory Mapping Control (S12XMMCV4)
CPU Local Address
(1)
(2)
Bit0
Bit0
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