MPC8533EVTAQGA Freescale Semiconductor, MPC8533EVTAQGA Datasheet - Page 392

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MPC8533EVTAQGA

Manufacturer Part Number
MPC8533EVTAQGA
Description
MPU POWERQUICC 783-PBGA
Manufacturer
Freescale Semiconductor
Datasheets

Specifications of MPC8533EVTAQGA

Processor Type
MPC85xx PowerQUICC III 32-Bit
Speed
1.0GHz
Voltage
0.95 V ~ 1.05 V
Mounting Type
Surface Mount
Package / Case
783-BBGA, FCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8533EVTAQGA
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
DDR Memory Controller
9-70
ODT_WR_CFG
ODT_PD_EXIT
PRETOACT
ACTTOPRE
ACTTOACT
ACTTORW
Parameter
REFREC
CASLAT
WRREC
MPC8533E PowerQUICC III Integrated Host Processor Family Reference Manual, Rev. 1
Table 9-54. Programming Differences Between Memory Types (continued)
Chip Select ODT Write
Configuration
ODT Powerdown Exit
Precharge to Activate
Timing
Activate to Precharge
Timing
Activate to Read/Write
Timing
CAS Latency
Refresh Recovery
Write Recovery
Activate A to Activate B
Description
DDR1
DDR2
DDR2
DDR1
DDR2
DDR1
DDR2
DDR1
DDR2
DDR2
DDR2
DDR2
DDR1
DDR2
DDR1
DDR1
DDR1
DDR1
Should always be set to 000
Can be enabled to assert ODT if desired. This
could be set differently depending on system
topology. However, ODT will typically be set to
assert for the chip select that is getting written to
(value would be set to 001).
Should be set according to the DDR2
specifications for the memory used. The JEDEC
parameter this applies to is t
the memory used (t
the memory used (t
Should be set, along with the Extended Activate to
Precharge Timing, according to the specifications
for the memory used (t
Should be set, along with the Extended Activate to
Precharge Timing, according to the specifications
for the memory used (t
the memory used (t
the memory used (t
Latency, to the desired CAS latency
Should be set, along with the Extended CAS
Latency, to the desired CAS latency
Recovery, to the specifications for the memory
used (t
Should be set, along with the Extended Refresh
Recovery, to the specifications for the memory
used (T
the memory used (t
the memory used (t
the memory used (t
the memory used (t
Should be set to 0000
Should be set according to the specifications for
Should be set according to the specifications for
Should be set according to the specifications for
Should be set according to the specifications for
Should be set, along with the Extended CAS
Should be set, along with the Extended Refresh
Should be set according to the specifications for
Should be set according to the specifications for
Should be set according to the specifications for
Should be set according to the specifications for
RFC
RFC
)
)
Differences
RP
RP
RCD
RCD
WR
WR
RRD
RRD
)
)
)
)
RAS
RAS
)
)
)
)
)
)
AXPD
.
Freescale Semiconductor
Section/page
9.4.1.2/9-11
9.4.1.4/9-14
9.4.1.5/9-16
9.4.1.5/9-16
9.4.1.5/9-16
9.4.1.5/9-16
9.4.1.5/9-16
9.4.1.5/9-16
9.4.1.5/9-16

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