HD64F38024DV Renesas Electronics America, HD64F38024DV Datasheet - Page 35

IC H8/SLP MCU FLASH 80QFP

HD64F38024DV

Manufacturer Part Number
HD64F38024DV
Description
IC H8/SLP MCU FLASH 80QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300L SLPr
Datasheets

Specifications of HD64F38024DV

Core Processor
H8/300L
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI
Peripherals
LCD, PWM, WDT
Number Of I /o
51
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F38024DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Figure 1.5 Bonding Pad Location Diagram of HCD64338024, HCD64338023,
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HCD64338022, HCD64338021, and HCD64338020 (Top View)
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(0, 0)
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Type code
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X
Rev. 8.00 Mar. 09, 2010 Page 13 of 658
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Chip size: 3.99 mm × 3.99 mm
Voltage level on the back of the chip: GND
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Section 1 Overview
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REJ09B0042-0800
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