HD64F38024DV Renesas Electronics America, HD64F38024DV Datasheet - Page 36

• Manufacturer Part Number: HD64F38024DV
• Description: IC H8/SLP MCU FLASH 80QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300L SLPr

Specifications of HD64F38024DV

• Core Processor: H8/300L
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: SCI
• Peripherals: LCD, PWM, WDT
• Number Of I /o: 51
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 1 Overview
Table 1.2
Pad No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
Note:
Rev. 8.00 Mar. 09, 2010 Page 14 of 658
REJ09B0042-0800
V
TEST Pad (No. 12) should be connected to V
If the pad of these aren’t connected to the power supply line, the LSI will not operate correctly. These values show the
coordinates of the centers of pads. The accuracy is ±5 μm. The home-point position is the chip’s center and the center
is located at half the distance between the upper and lower pads and left and right pads.
SS
Pads (No. 8 and 9) should be connected to power supply lines.
Pad Name
AV
P13/TMIG
P14/IRQ4/ADTRG
P16
P17/IRQ3/TMIF
X1
X2
AV
V
OSC2
OSC1
TEST
RES
P50/WKP0/SEG1
P51/WKP1/SEG2
P52/WKP2/SEG3
P53/WKP3/SEG4
P54/WKP4/SEG5
P55/WKP5/SEG6
P56/WKP6/SEG7
P57/WKP7/SEG8
P60/SEG9
P61/SEG10
P62/SEG11
P63/SEG12
P64/SEG13
P65/SEG14
P66/SEG15
P67/SEG16
P70/SEG17
P71/SEG18
P72/SEG19
P73/SEG20
P74/SEG21
P75/SEG22
P76/SEG23
P77/SEG24
P80/SEG25
P81/SEG26
P82/SEG27
P83/SEG28
SS
CC
SS
Bonding Pad Coordinates of HCD64338024, HCD64338023, HCD64338022,
HCD64338021, and HCD64338020
X (μm)
–1870
–1870
–1870
–1870
–1870
–1870
–1870
–1870
–1870
–1870
–1870
–1870
–1870
–1870
–1870
–1870
–1870
–1870
–1870
–1870
–1870
–1780
–1621
–1037
–896
–765
–635
–502
–371
–239
–108
23
156
287
419
550
682
833
1040
1621
1782
Coordinates
Y (μm)
1546
1274
1058
909
759
608
475
304
173
–10
–150
–290
–425
–560
–695
–831
–966
–1101
–1236
–1379
–1561
–1872
–1872
–1872
–1872
–1872
–1872
–1872
–1872
–1872
–1872
–1872
–1872
–1872
–1872
–1872
–1872
–1872
–1872
–1872
–1872
SS
.
Pad No.
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
Pad Name
P84/SEG29
P85/SEG30
P86/SEG31
P87/SEG32
PA3/COM4
PA2/COM3
PA1/COM2
PA0/COM1
V3
V2
V1
V
V
P90/PWM1
P91/PWM2
P92
P93
P94
P95
IRQAEC
P30/UD
P31/TMOFL
P32/TMOFH
P33
P34
P35
P36/AEVH
P37/AEVL
P40/SCK32
P41/RXD32
P42/TXD32
P43/IRQ0
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3/IRQ1/TMIC
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
CC
SS
X (μm)
1870
1870
1870
1870
1870
1870
1870
1870
1870
1870
1870
1870
1870
1870
1870
1870
1870
1870
1870
1870
1782
1621
1084
948
810
673
536
311
176
38
–99
–234
–482
–614
–745
–878
–1008
–1148
–1621
–1782
Coordinates
Y (μm)
–1571
–1395
–1251
–1111
–970
–831
–691
–550
–410
–270
–131
10
150
293
489
685
880
1076
1274
1546
1872
1872
1872
1872
1872
1872
1872
1872
1872
1872
1872
1872
1872
1872
1872
1872
1872
1872
1872
1872