HD64F38024DV Renesas Electronics America, HD64F38024DV Datasheet - Page 665

IC H8/SLP MCU FLASH 80QFP

HD64F38024DV

Manufacturer Part Number
HD64F38024DV
Description
IC H8/SLP MCU FLASH 80QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300L SLPr
Datasheets

Specifications of HD64F38024DV

Core Processor
H8/300L
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI
Peripherals
LCD, PWM, WDT
Number Of I /o
51
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F38024DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
The specifications of the chip form of the HCD64338024, HCD64338023, HCD64338022,
HCD64338021, and HCD64338020 are shown in figure G.1. The specifications of the chip form
of the HCD64F38024 and HCD64F38024R are shown in figure G.2. The specifications of the chip
form of the HCD64338024S, HCD64338023S, HCD64338022S, HCD64338021S, and
HCD64338020S are shown in figure G.3.
Figure G.1 Chip Sectional Figure of the HCD64338024, HCD64338023, HCD64338022,
Figure G.2 Chip Sectional Figure of the HCD64F38024 and HCD64F38024R
Appendix G Specifications of Chip Form
Maximum plain
Maximum plain
HCD64338021, and HCD64338020
X-direction: 3.99 ± 0.05
Y-direction: 3.99 ± 0.05
X-direction: 3.84 ± 0.05
Y-direction: 4.24 ± 0.05
X-direction: 3.99 ± 0.25
Y-direction: 3.99 ± 0.25
X-direction: 3.84 ± 0.25
Y-direction: 4.24 ± 0.25
Rev. 8.00 Mar. 09, 2010 Page 643 of 658
Appendix G Specifications of Chip Form
REJ09B0042-0800
Unit: mm
Unit: mm

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