HD64F38024DV Renesas Electronics America, HD64F38024DV Datasheet - Page 40

• Manufacturer Part Number: HD64F38024DV
• Description: IC H8/SLP MCU FLASH 80QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300L SLPr

Specifications of HD64F38024DV

• Core Processor: H8/300L
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: SCI
• Peripherals: LCD, PWM, WDT
• Number Of I /o: 51
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 1 Overview
Table 1.4
Pad No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Note: Pad No. 11 (TEST) should be connected to V
Rev. 8.00 Mar. 09, 2010 Page 18 of 658
REJ09B0042-0800
If it is not connected, the LSI will not operate correctly.
These values show the coordinates of the centers of pads. The accuracy is ±5 µm.
The home-point position is the chip’s center and the center is located at halfway between the upper and lower pads and
the left and right pads.
Pad Name
AV
P13/TMIG
P14/IRQ4/ADTRG
P16
P17/IRQ3/TMIF
X1
X2
V
OSC2
OSC1
TEST
RES
P50/WKP0/SEG1
P51/WKP1/SEG2
P52/WKP2/SEG3
P53/WKP3/SEG4
P54/WKP4/SEG5
P55/WKP5/SEG6
P56/WKP6/SEG7
P57/WKP7/SEG8
P60/SEG9
P61/SEG10
P62/SEG11
P63/SEG12
P64/SEG13
P65/SEG14
P66/SEG15
P67/SEG16
P70/SEG17
P71/SEG18
P72/SEG19
P73/SEG20
P74/SEG21
P75/SEG22
P76/SEG23
P77/SEG24
P80/SEG25
P81/SEG26
P82/SEG27
P83/SEG28
SS
CC
= AV
Bonding Pad Coordinates of HCD64338024S, HCD64338023S, HCD64338022S,
HCD64338021S, and HCD64338020S
SS
X (μm)
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1121
–927
–805
–703
–593
–483
–372
–263
–166
–47
55
166
277
388
499
610
701
790
885
1076
Coordinates
Y (μm)
1053
823
737
649
556
460
363
229
100
13
–74
–168
–265
–373
–481
–590
–698
–806
–892
–1091
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
–1338
SS
.
Pad No.
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
Pad Name
P84/SEG29
P85/SEG30
P86/SEG31
P87/SEG32
PA3/COM4
PA2/COM3
PA1/COM2
PA0/COM1
V3
V2
V1
V
V
P90/PWM1
P91/PWM2
P92
P93
P94
P95
IRQAEC
P30/UD
P31/TMOFL
P32/TMOFH
P33
P34
P35
P36/AEVH
P37/AEVL
P40/SCK32
P41/RXD32
P42/TXD32
P43/IRQ0
PB0/AN0
PB1/AN1
PB2/AN2
PB3/AN3/IRQ1/TMIC
PB4/AN4
PB5/AN5
PB6/AN6
PB7/AN7
CC
SS
X (μm)
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1131
936
831
735
631
526
421
317
212
108
3
–101
–249
–362
–476
–589
–702
–791
–880
–1081
Coordinates
Y (μm)
–1121
–929
–820
–721
–610
–499
–388
–277
–189
–91
6
156
362
528
614
699
785
871
957
1147
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338
1338