HD64F38024DV Renesas Electronics America, HD64F38024DV Datasheet - Page 37

IC H8/SLP MCU FLASH 80QFP

HD64F38024DV

Manufacturer Part Number
HD64F38024DV
Description
IC H8/SLP MCU FLASH 80QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300L SLPr
Datasheets

Specifications of HD64F38024DV

Core Processor
H8/300L
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI
Peripherals
LCD, PWM, WDT
Number Of I /o
51
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F38024DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Figure 1.6 Bonding Pad Location Diagram of HCD64F38024, HCD64F38024R (Top View)
11
13
15
17
19
21
23
1
3
5
7
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10
12
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2
4
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8
24
81
25
80
26
79
27
28
78
29
77
30
76
31
(0, 0)
75
32
74
33
73
34 36 38
Y
35 37
72
71
Chip size: 3.84 mm × 4.24 mm
Voltage level on the back of the chip: GND
70
X
: NC pad
Rev. 8.00 Mar. 09, 2010 Page 15 of 658
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Type code
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65
41
64
Section 1 Overview
REJ09B0042-0800
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