HD64F38024DV Renesas Electronics America, HD64F38024DV Datasheet - Page 667

• Manufacturer Part Number: HD64F38024DV
• Description: IC H8/SLP MCU FLASH 80QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300L SLPr

Specifications of HD64F38024DV

• Core Processor: H8/300L
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: SCI
• Peripherals: LCD, PWM, WDT
• Number Of I /o: 51
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

The form of the bonding pads for the HCD64338024, HCD64338023, HCD64338022,
HCD64338021, HCD64338020, HCD64F38024, HCD64F38024R, HCD64338024S,
HCD64338023S, HCD64338022S, HCD64338021S, and HCD64338020S is shown in figure H.1.
Appendix H Form of Bonding Pads
Figure H.1 Bonding Pad Form
72 mm
Rev. 8.00 Mar. 09, 2010 Page 645 of 658
Appendix H Form of Bonding Pads
5 mm
Bonding area
Metal layer
REJ09B0042-0800