HD64F38024DV Renesas Electronics America, HD64F38024DV Datasheet - Page 39

IC H8/SLP MCU FLASH 80QFP

HD64F38024DV

Manufacturer Part Number
HD64F38024DV
Description
IC H8/SLP MCU FLASH 80QFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300L SLPr
Datasheets

Specifications of HD64F38024DV

Core Processor
H8/300L
Core Size
8-Bit
Speed
10MHz
Connectivity
SCI
Peripherals
LCD, PWM, WDT
Number Of I /o
51
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F38024DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
11
13
15
17
19
Figure 1.7 Bonding Pad Location Diagram of HCD64338024S, HCD64338023S,
1
3
5
7
9
10
12
14
16
18
20
2
4
6
8
HCD64338022S, HCD64338021S, and HCD64338020S (Top View)
80
21
79
22
78
23
77
24
76
25
75
26
74
27
73
28
72
29
(0.0)
71
30
70
31
Y
69
32
68
33
Chip size: 2.91 mm × 2.91 mm
Voltage level on the back of the chip: GND
X
67
34
Rev. 8.00 Mar. 09, 2010 Page 17 of 658
66
35
65
36
64
37
63
38
62
39
61
40
Section 1 Overview
REJ09B0042-0800
60
58
56
54
52
50
48
46
44
42
59
57
55
53
51
49
47
45
43
41

Related parts for HD64F38024DV