tdat04622 ETC-unknow, tdat04622 Datasheet - Page 25

• Manufacturer Part Number: tdat04622
• Description: Tdat Sonet/sdh 155/622/2488 Mbits/s Data Interfaces
• Manufacturer: ETC-unknow

May 2001
Agere Systems Inc.
Packaging and Pinouts (P)
P4. Power Dissipation
The worst-case power dissipation of TDAT042G5 is currently estimated to be 7.5 W. The minimum and maximum
power dissipation is listed in Table 9, as well as the relative package thermal characteristics.
Table 9. Power Dissipation and Relative Package Thermal Characteristics
* θ
† ψ
Maximum junction temperature of TDAT042G5 is 125 °C. Therefore, maximum case temperature under natural
convection conditions must be less than approximately 50 °C, and in this case, an external heat sink is required.
References
Jeff Weiss, 600 LBGA Thermal Test Report, February 25, 1999.
HL250C 3.3 Volt 0.25 µ m CMOS Standard-Cell Library (MN98-060ASIC-02), pages 2-2 and 2-3.
Workaround
An external heat sink is required.
Corrective Action
Power consumption will be addressed in future versions of the device.
Power Dissipation:
Thermal Performance
Correlation Factor
by the device.
JA
JC
(JEDEC standard
conditions)*
Between Die and Case
Temperatures
Minimum
Maximum
= (T
= (T
J
J
– T
Parameter
– T
A
C
)/P
)/P
D
D
: T
: T
†
J
J
= junction temperature, T
= junction temperature, T
Symbol
ψ
θ
P
JA
JC
D
(continued)
A
C
= ambient temperature of medium surrounding the package, P
STS-3/STM-1 line rate
STS-12/STM-4 and STS-48/
Standard JEDEC 4-layer PWB:
I
I
I
Standard JEDEC 4-layer PWB:
I
I
I
= package temperature (top, dead-center), P
Standard natural convection
200 LFPM airflow
800 LFPM airflow
Standard natural convection
200 LFPM airflow
800 LFPM airflow
STM-16 line rates
Test Conditions
for Version 1 and 1A of the Device
Min
D
—
—
—
—
—
—
—
—
= electrical power dissipated by the device.
Typ
6.5
0.3
0.4
0.5
3
6
9
5
D
= electrical power dissipated
Max
—
—
—
—
—
—
—
—
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
W
W
23