DF2166VT33WV Renesas Electronics America, DF2166VT33WV Datasheet - Page 156

MCU 16BIT FLASH 3V 512K 144-TQFP

DF2166VT33WV

Manufacturer Part Number
DF2166VT33WV
Description
MCU 16BIT FLASH 3V 512K 144-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2166VT33WV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2166VT33WV
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
DF2166VT33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Table 6.3
Note:
Rev. 3.00, 03/04, page 114 of 830
BRSTRM CS256E
0
1
*
0
1
0
1
In the burst ROM interface, the bus width is specified by the ABW bit in WSCR, the
number of full access states (wait can be inserted) is specified by the AST bit in WSCR,
and the number of access cycles in burst access is specified regardless of the AST bit
setting.
Bit Settings and Bus Specifications of Basic Bus Interface
CPCSE
0
1
0
1
0
1
0
1
Basic Extended
Area
Basic extended
area
ABW, AST,
WMS1, WMS0,
WC1, WC0
Burst ROM
interface*
ABW, AST,
WMS0, WC1,
WC0, BRSTS1,
BRSTS0
256-kbyte
Extended Area
Used as basic
extended area
ABW256, AST256,
WMS10, WC11,
WC10
Used as burst
ROM interface
ABW256, AST256,
WMS10, WC11,
WC10
Areas
CP Extended Area (Basic
Mode)
Used as basic extended
area
ABWCP, ASTCP, WMS21,
WMS20, WC21, WC20
Same as when CS256E = 0
Used as burst ROM
interface
ABWCP, ASTCP, WMS21,
WMS20, WC21, WC20
Same as when CS256E = 0

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