DF2166VT33WV Renesas Electronics America, DF2166VT33WV Datasheet - Page 23

• Manufacturer Part Number: DF2166VT33WV
• Description: MCU 16BIT FLASH 3V 512K 144-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2166VT33WV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, LPC, SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 106
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-TQFP, 144-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

17.5 Usage Note........................................................................................................................ 594
Section 18 A/D Converter..................................................................................595
18.1 Features............................................................................................................................. 595
18.2 Input/Output Pins .............................................................................................................. 597
18.3 Register Descriptions ........................................................................................................ 598
18.4 Operation .......................................................................................................................... 601
18.5 Interrupt Source ................................................................................................................ 604
18.6 A/D Conversion Accuracy Definitions ............................................................................. 604
18.7 Usage Notes ...................................................................................................................... 606
Section 19 RAM ................................................................................................609
Section 20 Flash Memory (0.18-µm F-ZTAT Version) ....................................611
20.1 Features............................................................................................................................. 611
20.2 Input/Output Pins .............................................................................................................. 620
20.3 Register Descriptions ........................................................................................................ 620
20.4 On-Board Programming Mode ......................................................................................... 638
20.5 Protection .......................................................................................................................... 665
18.1.1 Block Diagram..................................................................................................... 596
18.3.1 A/D Data Registers A to D (ADDRA to ADDRD) ............................................. 598
18.3.2 A/D Control/Status Register (ADCSR) ............................................................... 599
18.3.3 A/D Control Register (ADCR) ............................................................................ 600
18.4.1 Single Mode......................................................................................................... 601
18.4.2 Scan Mode ........................................................................................................... 601
18.4.3 Input Sampling and A/D Conversion Time ......................................................... 602
18.4.4 External Trigger Input Timing............................................................................. 603
18.7.1 Permissible Signal Source Impedance ................................................................. 606
18.7.2 Influences on Absolute Accuracy ........................................................................ 606
18.7.3 Setting Range of Analog Power Supply and Other Pins ...................................... 607
18.7.4 Notes on Board Design ........................................................................................ 607
18.7.5 Notes on Noise Countermeasures ........................................................................ 607
20.1.1 Operating Mode ................................................................................................... 613
20.1.2 Mode Comparison................................................................................................ 614
20.1.3 Flash Memory MAT Configuration..................................................................... 615
20.1.4 Block Division ..................................................................................................... 616
20.1.5 Programming/Erasing Interface ........................................................................... 618
20.3.1 Programming/Erasing Interface Register............................................................. 621
20.3.2 Programming/Erasing Interface Parameter .......................................................... 628
20.4.1 Boot Mode ........................................................................................................... 638
20.4.2 User Program Mode............................................................................................. 642
20.4.3 User Boot Mode................................................................................................... 652
20.4.4 Procedure Program and Storable Area for Programming Data ............................ 655
Rev. 3.00, 03/04, page xxi of xl