DF2166VT33WV Renesas Electronics America, DF2166VT33WV Datasheet - Page 75

MCU 16BIT FLASH 3V 512K 144-TQFP

DF2166VT33WV

Manufacturer Part Number
DF2166VT33WV
Description
MCU 16BIT FLASH 3V 512K 144-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2166VT33WV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, LPC, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
106
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
40K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2166VT33WV
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
DF2166VT33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Table 2.3
Instruction
MOV
MOVFPE
MOVTPE
POP
PUSH
LDM*
STM*
Notes: 1. Size refers to the operand size.
2
2
2. Since register ER7 functions as the stack pointer in an STM/LDM instruction, it cannot
B: Byte
W: Word
L: Longword
be used as an STM/LDM register.
Data Transfer Instructions
Size*
B/W/L
B
B
W/L
W/L
L
L
1
Function
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
Cannot be used in this LSI.
Cannot be used in this LSI.
@SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn
Rn → @-SP
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @-SP. PUSH.L ERn is identical to MOV.L ERn, @-SP.
@SP+ → Rn (register list)
Pops two or more general registers from the stack.
Rn (register list) → @-SP
Pushes two or more general registers onto the stack.
Rev. 3.00, 03/04, page 33 of 830

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