DF2166VT33WV Renesas Electronics America, DF2166VT33WV Datasheet - Page 842

• Manufacturer Part Number: DF2166VT33WV
• Description: MCU 16BIT FLASH 3V 512K 144-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2166VT33WV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, LPC, SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 106
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-TQFP, 144-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

25.3.4
Table 25.9 shows the Multiplex bus interface timing. In subclock (φSUB = 32.768 kHz) operation,
external expansion mode operation cannot be guaranteed.
Table 25.9 Multiplex Bus Timing
Condition: VCC = 3.0 V to 3.6 V, VSS = 0 V, φ = 5 MHz to 33 MHz
Rev. 3.00, 03/04, page 800 of 830
Item
Address delay time
Address setup time 2
Address hold time 2
CS delay time (IOS,
CS256, CPCS1)
AH delay time
RD delay time 1
RD delay time 2
Read data setup time
Read data hold time
Read data access time 2 t
Read data access time 4 t
Read data access time 6 t
Read data access time 7 t
WR delay time 1
WR delay time 2
WR pulse width time 1
WR pulse width time 2
Write data delay time
Write data setup time
Write data hold time
Multiplex Bus Timing
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
AD
AS2
AH2
CSD
AHD
RSD1
RSD2
RDS
RDH
ACC2
ACC4
ACC6
ACC7
WRD1
WRD2
WSW1
WSW2
WDD
WDS
WDH
Min..
—
0.5 × t
1.0 × t
—
—
—
—
15
0
—
—
—
—
—
—
1.0 × t
1.5 × t
—
0
0.5 × t
cyc
cyc
cyc
cyc
cyc
− 15
− 10
− 20
− 20
− 5
Max.
15
—
—
15
15
15
15
—
—
1.5 × t
2.5 × t
3.5 × t
4.5 × t
15
15
—
—
25
—
—
cyc
cyc
cyc
cyc
− 25
− 25
− 25
− 25
Unit
ns
Test Conditions
Figures 25.17,
25.18