HD64F2638F20J Renesas Electronics America, HD64F2638F20J Datasheet - Page 39

• Manufacturer Part Number: HD64F2638F20J
• Description: IC H8S MCU FLASH 256K 128-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2638F20J

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: CAN, SCI, SmartCard
• Peripherals: Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 12x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 15 I
15.1 Overview........................................................................................................................... 545
15.2 Register Descriptions ........................................................................................................ 550
15.3 Operation .......................................................................................................................... 576
15.4 Usage Notes ...................................................................................................................... 599
Section 16 Controller Area Network (HCAN)
16.1 Overview........................................................................................................................... 611
16.2 Register Descriptions ........................................................................................................ 619
REJ09B0103-0800 Rev. 8.00
May 28, 2010
15.1.1 Features................................................................................................................ 545
15.1.2 Block Diagram..................................................................................................... 546
15.1.3 Input/Output Pins ................................................................................................. 548
15.1.4 Register Configuration......................................................................................... 549
15.2.1 I
15.2.2 Slave Address Register (SAR) ............................................................................. 553
15.2.3 Second Slave Address Register (SARX) ............................................................. 554
15.2.4 I
15.2.5 I
15.2.6 I
15.2.7 Serial Control Register X (SCRX)....................................................................... 573
15.2.8 DDC Switch Register (DDCSWR) ...................................................................... 574
15.2.9 Module Stop Control Register B (MSTPCRB).................................................... 575
15.3.1 I
15.3.2 Initial Setting........................................................................................................ 578
15.3.3 Master Transmit Operation .................................................................................. 578
15.3.4 Master Receive Operation.................................................................................... 582
15.3.5 Slave Receive Operation...................................................................................... 587
15.3.6 Slave Transmit Operation .................................................................................... 592
15.3.7 IRIC Setting Timing and SCL Control ................................................................ 595
15.3.8 Operation Using the DTC .................................................................................... 596
15.3.9 Noise Canceler ..................................................................................................... 597
15.3.10 Initialization of Internal State .............................................................................. 597
16.1.1 Features................................................................................................................ 611
16.1.2 Block Diagram..................................................................................................... 613
16.1.3 Pin Configuration................................................................................................. 614
16.1.4 Register Configuration......................................................................................... 615
16.2.1 Master Control Register (MCR) .......................................................................... 619
16.2.2 General Status Register (GSR) ............................................................................ 620
16.2.3 Bit Configuration Register (BCR) ....................................................................... 622
(Only for the H8S/2638, H8S/2639, and H8S/2630)
2
2
2
2
2
2
C Bus Data Register (ICDR) ............................................................................. 550
C Bus Mode Register (ICMR)........................................................................... 555
C Bus Control Register (ICCR)......................................................................... 559
C Bus Status Register (ICSR) ........................................................................... 567
C Bus Data Format............................................................................................ 576
C Bus Interface [Option]
............................................................ 611
........................... 545
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