MC68302EH16C Freescale Semiconductor, MC68302EH16C Datasheet - Page 343

• Manufacturer Part Number: MC68302EH16C
• Description: IC MPU MULTI-PROTOCOL 132-PQFP
• Manufacturer: Freescale Semiconductor

Specifications of MC68302EH16C

• Processor Type: M683xx 32-Bit
• Speed: 16MHz
• Voltage: 5V
• Mounting Type: Surface Mount
• Package / Case: 132-MQFP, 132-PQFP
• Controller Family/series: 68K
• Core Size: 32 Bit
• Ram Memory Size: 1152Byte
• Cpu Speed: 16MHz
• No. Of Timers: 3
• Embedded Interface Type: SCP, TDM
• Digital Ic Case Style: PQFP
• Rohs Compliant: Yes
• Family Name: M68000
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 16MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 5V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 132
• Package Type: PQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

The approximate compiled object code sizes are as follows:
A RAM scratchpad area (around 4 kbytes) and buffer space are also required for the mod-
ules (except for EDX). Code sizes may be reduced from the figures above if optional module
features are not compiled.
An additional user-interface module provides a menu-driven user interface to the IMP and
each functional protocol module. This module may be used for chip evaluation or as a tool
for debugging user-developed applications. Menu options will allow a user to examine the
appropriate module's memory structures (or the register set and on-chip dual-port RAM of
the IMP) or to issue specific commands. The commands may result in specific IMP com-
mands or in the execution of protocol-defined primitives in one of the protocol modules.
The chip driver module is available in C source code form. The source code requires no li-
cense.
MOTOROLA
The EDX module features are as follows:
• Message-oriented interface
• Independent of layer 2 and layer 4 implementation
• The EDX event driven executive is an operating system kernel that provides:
• EDX was designed to be:
• EDX was designed for use in communications environments. It provides “soft” real-time
—DTE/DCE
—- Permanent virtual circuit/virtual call
—- D-BIT support
—- On-line registration support
—- TOA/NPI address mode
—- Fast select facility support
—- Logical channel (and group) numbers
—- Protocol parameters (w, T11, T12, T21, T22, N12, N13)
—- Maximum data packet length (unlimited)
—Multitasking with simple task scheduling
—Message passing between tasks
—Memory allocation
—Fast (written mostly in M68000 Assembler)
—Efficient (uses about 1.5 kbytes of ROM)
scheduling, not the “hard” real-time scheduling needed in many event control applica-
tions.
—Chip Drivers
—LAPD
—LAPB
—X.25
—EDX
24K
24K
20K
36K
1.5K
MC68302 USER’S MANUAL
Development Tools and Support
B-5